February 27 ~ 28, 2026, Vancouver, Canada
Hybrid--Registered authors can present their work online or face to face New
7th International Conference on Signal Processing, VLSI Design & Communication Systems (SVC 2026) invites high quality research contributions that advance the state of the art in signal processing, semiconductor design, embedded intelligence, and next generation communication systems. As intelligent devices, high performance hardware, and advanced communication technologies converge, SVC 2026 provides a premier international forum for researchers, engineers, and practitioners to present innovations, share insights, and shape the future of connected and intelligent systems.
7th International Conference on Signal Processing, VLSI Design & Communication Systems (SVC 2026) invites high quality research contributions that advance the state of the art in signal processing, semiconductor design, embedded intelligence, and next generation communication systems. As intelligent devices, high performance hardware, and advanced communication technologies converge, SVC 2026 provides a premier international forum for researchers, engineers, and practitioners to present innovations, share insights, and shape the future of connected and intelligent systems.
We welcome original research papers, visionary ideas, industrial case studies, and system demonstrations.
Authors are invited to submit papers through the conference Submission System by January 31, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).
Selected papers from SVC 2026, after further revisions, will be published in the special issue of the following journal.
Important Dates
Second Batch : (Submissions after December 29, 2025)January 31, 2026
February 10, 2026
February 17, 2026
Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC Digital Library

Jiawei Zhang
USA

David Kuhlen
Technische Hochschule Lubeck
Germany

Jiabao Hu
Northeastern University
USA