February 27 ~ 28, 2026, Vancouver, Canada
Hybrid--Registered authors can present their work online or face to face New
7th International Conference on Machine Learning and Soft Computing (MLSC 2026) invites high quality research contributions that advance the theory, algorithms, and applications of machine learning and soft computing. As intelligent systems continue to shape science, engineering, and society, MLSC 2026 provides a premier international forum for researchers, practitioners, and innovators to present breakthroughs, exchange ideas, and explore emerging challenges across learning algorithms, intelligent optimization, and computational intelligence.
7th International Conference on Machine Learning and Soft Computing (MLSC 2026) invites high quality research contributions that advance the theory, algorithms, and applications of machine learning and soft computing. As intelligent systems continue to shape science, engineering, and society, MLSC 2026 provides a premier international forum for researchers, practitioners, and innovators to present breakthroughs, exchange ideas, and explore emerging challenges across learning algorithms, intelligent optimization, and computational intelligence.
We welcome original research papers, visionary ideas, industrial case studies, and system demonstrations.
Authors are invited to submit papers through the conference Submission System by January 31, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).
Selected papers from MLSC 2026, after further revisions, will be published in the special issue of the following journal.
Important Dates
Second Batch : (Submissions after December 29, 2025)January 31, 2026
February 10, 2026
February 17, 2026
Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC Digital Library

Jiawei Zhang
USA

David Kuhlen
Technische Hochschule Lubeck
Germany

Jiabao Hu
Northeastern University
USA

Max Liu
William P. Clements High School
USA